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I'm just a lucky guy? |
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| 11-24-2012, 02:10 PM | |
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![]() I'm sorry if you took anything I said as a personal attack, it wasn't. ![]() It depends on how you measure success. Is it a success if you can make it turn on and it functions when you're done but it fails within 6-12 months or less? It may appear to function most of the time but behave erratically under higher loads. I would say you've been lucky, but it's hard to know if any internal damage resulted from your technique. X-ray is the only way to really evaluate the solder joints. The particulars of a given ic and pcb design and the exact parameters of the overheating you applied, would make a big difference in your results. It would be very hard if not impossible to get the solder hot enough to prevent a cold solder joint from forming while keeping the internals cool enough to prevent damage. Following the concept of entropy and the second law of thermodynamics, it shouldn't be hard to understand that if you overheat an ic, the internals of the chip will get hotter than the solder pads on the outside of the chip where the solder is. This is not a good thing. Your assumption that the failure resulted from the chip overheating to a point where the solder flowed is flawed. It's more likely that fractured or brittle solder joints, warping, or corrosion are to blame (caused by over heating or thermal shock in most cases but at lower temperatures than would cause solder to reflow). Personally I use an old convection oven that I modified a bit and it works great on boards where all the components can handle the heat. Last edited by jkee; 11-24-2012 at 04:55 PM.. |
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It's rare that I would get that way and it would be evident. The IQ challenged thing was my way of saying that all that info is above my knowledge and understanding, well, maybe not understanding, but certainly beyond my knowledge level. |
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Where did you purchase the motherboard with the Intel GPU? I have a XPS 1530. |
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