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2TB Samsung 990 PRO NVMe Gen4 SSD $160
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| Product Name: | Samsung 990 PRO Internal SSD Overview |
| Product Description: | Built using their V-NAND 3-bit MLC flash technology and in-house controller, the Samsung 2TB 990 PRO PCIe 4.0 x4 M.2 Internal SSD offers an M.2 2280 form factor and a PCIe 4.0 x4 / NVMe 2.0 interface to deliver sequential read speeds of up to 7450 MB/s and sequential write speeds of up to 6900 MB/s. Users will also have access to encryption via TCG/Opal 2.0 and MS eDrive, while a TBW (Total Bytes Written) rating of 1200TB helps ensure a long operational life. |
| Product SKU: | 1726548 |
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Last Edited by StrawMan86 | Staff
May 21, 2023
at
01:22 PM
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https://www.newegg.com/mushkin-en...6820226975
I went with the P44 Pro over this.
Of course it would. I was never saying heat syncs aren't good. Thermal dynamics in an enclosed box, which is what this is, it's a computer case, says you must get the heat out of the box, heat syncs just move the heat away from an area, but if your box isn't effectively blowing the heat out, the heat sync is moot. In tandem, they work great; we use it all the time. But our priority is getting the actual heat out of the box which was my original point that he didn't understand and conflated.
You clearly have no concept of thermodynamics if you think direct air contact is better than direct contact with a big chunk of metal.
First of all, it's "sink" not "sync". You sure you work for the DoD?
As for "moving the heat out", are you trying to imagine the computer case as existing inside a vacuum or made of an insulating material? If so, you're the one conflating matters.
Nobody is talking about wrapping up the case in fiberglass and letting the heatsink do all the work. There's air moving in and out, in addition to making contact with the case material, even with static pressure.
The fact remains, copper and aluminum are thousands of times better at thermal conduction than air.
If you have a material dissipating heat over a small surface area, the universal consensus is to give it more surface area by which to dissipate.
Do you think catalytic converters would get stolen as frequently if they could be contained in a 1sqin package found inside the engine and use an equivalent amount of material? Obviously not.
And if HVAC units could get away with using a lot less copper and aluminum to radiate heat, don't you think they'd do it?
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As for "moving the heat out", are you trying to imagine the computer case as existing inside a vacuum or made of an insulating material? If so, you're the one conflating matters.
Nobody is talking about wrapping up the case in fiberglass and letting the heatsink do all the work. There's air moving in and out, in addition to making contact with the case material, even with static pressure.
The fact remains, copper and aluminum are thousands of times better at thermal conduction than air.
If you have a material dissipating heat over a small surface area, the universal consensus is to give it more surface area by which to dissipate.
Do you think catalytic converters would get stolen as frequently if they could be contained in a 1sqin package found inside the engine and use an equivalent amount of material? Obviously not.
And if HVAC units could get away with using a lot less copper and aluminum to radiate heat, don't you think they'd do it?
First of all, I'm typing on my phone. Second, yes I work on government military projects. Third, you're not worth my time. I'll happily answer OP's questions